SPK-EBM-A18 CLASS 2 Module
Bluetooth 4.0 dual mode USB HCI module/ Dongle
Description
- Support for Bluetooth low energy available with CSR8510WLCSP
- Fully qualified Bluetooth® v4.0 specification system
- Dual-mode Bluetooth/Bluetooth low energy operation
- HCI mode operation with full Bluetooth stack
- HID proxy mode for boot mode support and stackless operation
- High-sensitivity Bluetooth and Bluetooth low energy receiver
- Class 1/2/3 support without external power amplifier or TX/RX switch
- Baseband processor running Bluetooth HCI firmware stack
- Full-speed USB 2.0 interface
- RFKill functionality for PCs (hardware and software radio enable controls)
- WLAN coexistence interface
- External EEPROM I2C interface
- On-chip synthesizer
- Internal power regulation for self-contained operation from USB vbus for dongles
- Selectable I/O voltage
- Real-time signal strength indicator (RSSI)
- Dimensions: 15.0 mm x 11.3 mm x 1.8 mm (with printed antenna)
- Storage temperature range: -40ºC ~ +85ºC
- Operating temperature range: -30ºC ~ +85ºC
- Support for Bluetooth low energy available with CSR8510WLCSP
- Fully qualified Bluetooth® v4.0 specification system
- Dual-mode Bluetooth/Bluetooth low energy operation
- HCI mode operation with full Bluetooth stack
- HID proxy mode for boot mode support and stackless operation
- High-sensitivity Bluetooth and Bluetooth low energy receiver
- Class 1/2/3 support without external power amplifier or TX/RX switch
- Baseband processor running Bluetooth HCI firmware stack
- Full-speed USB 2.0 interface
- RFKill functionality for PCs (hardware and software radio enable controls)
- WLAN coexistence interface
- External EEPROM I2C interface
- On-chip synthesizer
- Internal power regulation for self-contained operation from USB vbus for dongles
- Selectable I/O voltage
- Real-time signal strength indicator (RSSI)
- Dimensions: 15.0 mm x 11.3 mm x 1.8 mm (with printed antenna)
- Storage temperature range: -40ºC ~ +85ºC
- Operating temperature range: -30ºC ~ +85ºC