Product Name: |
Charateristics |
Description: |
| Precautions for
Safety |
- Fail-Safe Design for Equipment
In application of the Ceramic Resonators (Chip Type), it is recommended
that equipment shall be protected by adding a protective and/or retardant
design circuit against deterioations and failures of the Ceramic Resonators.
- Operating Temperature
Ranges
The Ceramic Resonators (Chip Type) shall not be operated beyond the
specified "Operating Temperature Range" in the Catalog or
the Specifications.
- Changes/Drifts in Oscillating
Frequency
It shall be noted that oscillating frequencies of the Ceramic Resonators
(Chip Type) may drift depending IC applied (the type names, the manufacturer)
and capacitance values of external capacitors C1* and C2* and the circuit
design.
Note: *Refer to "Standard Test Circuit Diagram" in the Catalog
or the individual Specification.
- Abnormal Oscillation
The Ceramic Resonators (Chip Type) are always acompanied by suprious
resonances. Hence in the circuit, suprious oscillations or stop of oscillation
may occur depending on the circuit design (IC applied, frequency characteristics
of the IC, supply voltage etc.) and/or environmental conditions Attention
shall be paid to those abnormalities above mentioned in circuit design.
- Stray Capacitance
Stray capacitance and insulation resistances on printed circuit board
may cause abnormalities of the Ceramic Resonators such as "higher
harmonic oscillations".or "stop of oscillations".
Attention shall be paid to those abnormalities above mentioned in circuit
design.
- Matching Capacitors
In application of the Ceramic Resonators (Chip Type) of Type P and L,
two selected capacitors** shall be added for constructing "Colpitts
Oscillation Circuit".
Note: **The capacitance values are specified in the Catalog or the Specification
of Type P and L.
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| Prohibited Applications
|
- "Flow Soldering"
shall not be applied to the Ceramic Resonators (Chip Type).
- "Ultrasonic Cleaning"
and "Ultrasonic Welding" shall not be applied to the Ceramic
Resonators (Chip Type) for preventing them from electrical failures
and mechanical damages.
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| Application Notes |
- Overvoltage Spikes & Electrostatic
Discharges
Abnormal/excess electrical stresses such as over voltage spikes and
electrostatic discharges may cause electrical deteriorations and failures
of the Ceramic Resonators and affect reliability of the devices.
- Abnormal mechanical stresses
- Abnormal/excess mechanical stresses
such as falling shocks shall not be applied to the Ceramic Resonators
(Chip Type) in handling, to prevent them from being damaged or craked.
- Dropped devices shall not be
used.
- Surface Mouting Consideration
In automated mounting of The Ceramic Resonators (Chip Type) on printed
circuit boads, any bending, expanding and pulling forces or shocks against
the Ceramic Resonators (Chip Type) shall be kept minimum to prevent
them from electrical failures and mechanical damages of the devices.
- Soldering (Reflow)
- Solderings of The Ceramic Resonators
(Chip Type) shall conform to the Soldering conditions in the individual
Specifications.
- The Resonators are designed
for "Reflow Solderings "
- In the reflow solderings, too
high Soldering temperatures and too large temperature gradient such
as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
- Following soldering conditions
are recommended; Refer to Fig. 1
- Preheating: 150oC
for 60 to 120 seconds
- Soldering Temperature:220oC
for 10 seconds max.
- Peak Soldering Temperature:240oC
max.
- Soldering Flux
a) Rosin-based and non-activated soldering flux is recommended.
b) The content of halogen in the flux shall be 0.1 wt. % or less.
Note: In case of water-solube type or activated type soldering flux
being applied, the flux residues on the surface of PC boards, may have
influences on the reliability of the Ceramic Resonators, and cause deteriorations
and failures of the devices.
- Post Soldering Cleaning
- Application of ultrasonic cleaning
is prophibited.
- Cleaning Conditions such as
kinds of cleaning solvents, immersion time and temperatures etc.
shall be checked by experiments before production.
- Operating and Storage Conditions
The Ceramic Resonators (Chip Type) shall not be operated and/or stored
under following environmental conditions:
- To be exposed directly to water
or salt water
- To be exposed directly to sunlight
- Under conditions of dew formation
- Under conditions of corrosive
atomosphere such as hydrogen sulfide, sulfurous acid, chlorine and
ammonia
- Long Term Storage
The Ceramic Resonators (Chip Type) shall not be stored under severe
conditions of high temperatures and high humidities.
Store them indoors under 40(C max. and 75% RH max. Use them within one
year and check the solderability before use.
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Features: |
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Specification: |
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Safety Approval: |
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Other Description: |
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